FY2024 CHIPS R National Advanced Packaging Manufacturing Program (NAPMP) Materials Substrates

The CHIPS Research and Development Program (CHIPS R) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems. This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. Through this NOFO, the NAPMP program seeks to achieve the following objectives: (1) Accelerate domestic R&D and innovation in advanced packaging materials and substrates; (2) Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security; (3) Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and (4) Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry. NAPMP plans to release subsequent NOFOs relevant to other research areas and for an Advanced Packaging Piloting Facility (APPF), where successful development efforts will be transitioned and validated for scaled transition to U.S. manufacturing. The APPF is expected to be a key facility for technology transfer to high-volume manufacturing.